SEMICONDUCTOR CHILLERS

Heating within 40 ℃ by the hot air of the gas extraction compressor.
The Chiller circulation system adopts a fully enclosed design and uses a magnetic driven pump.
Chiller 100% helium testing, 100% safety compliance testing to ensure safety and reliability.
Chiller 100% continuous operation of the copying machine after 24 hours

Air volume range: 15m ³/ H~100m ³/ H
Efforts should be made to cool down the corrosion of materials, such as dry compressed air, nitrogen gas, argon gas, etc., and introduce them into the LQ series equipment at room temperature. The resulting materials can reach the standard low temperature and be supplied to the components or heat exchangers for demand testing.

The temperature rise and fall rate is very fast, with a Temperature range of 150 ℃ to -55 ℃<10 seconds, and a maximum flow rate of 30m ³/ H;
Real time monitoring of the actual temperature of the tested IC, achieving closed-loop feedback

Equipped with a cooler, it avoids the consumption of liquid nitrogen, carbon dioxide, etc. Each system includes a chuck and a cold and hot control unit;

Fast temperature rise and fall, constant temperature control, suitable for testing RF devices and high-density power devices

Gas condensation liquefaction recovery

Connect the waste water to the equipment through a suction fan, and collect and separate it into a collection tank by reducing the temperature for liquefaction, while discharging other materials;

1. Cooling photolithography, dry etching
2. Cooling the furnace body and walls
3. Cooling CVD reaction chambers and equipment
4. Cooling targets and PVD equipment
5. Cooling ion implantation equipment
6. Cool the grinding disc and equipment
7. Cooling probe table, grinding disc and equipment
8. Cooling packaging equipment and mold
9. Fluoride waste gas condensation recovery

Condenser: micro-channel heat exchanger (air-cooled)plate heat exchanger (water-cooled)

Control system: PLC programmable controller

Communication: RS485 interface Modbus RTU protocol/ Ethernet interface TCP/lP protocol

Shell material: cold-rolled plate spray RAL7035lnsidethe pipeline: stainless steel SUS304,copper, ceramics,silicon carbide,silicone sealant, PTFE

Heating function

Due to the use of heat generated during heating, circulating heating can be achieved without the need for a heater.